 General Capabilities
- 1 - 42 Layers
- 3mil/3mil trace width/ spacing
Impedance Control
- Microvias
(HDI)
Blind & Buried vias
Pad on Vias
Sequential lamination
- Surface Finishes: HASL, Entek 106(OSP)
Silver Immersion, Electroless Ni/Au
Thincore MLBs
Fast-Turn PCB Prototyping Lead Time
| |
China |
Japan |
| Delivery |
1-2L |
4
L |
6
L |
8
L |
10
L |
1-2L |
4
L |
6
L |
8
L |
10
L |
| Standard(days) |
4 |
5 |
7 |
8 |
10 |
4 |
4 |
5 |
6 |
7 |
| Express(days) |
3 |
4 |
5 |
6 |
8 |
3 |
3 |
4 |
5 |
6 |
| Super
Express(days) |
2 |
3 |
4 |
5 |
6 |
2 |
2 |
3 |
4 |
5 |
| Mach(days) |
1 |
2 |
3 |
4 |
5 |
|
|
|
|
|
| Miracle(days) |
|
|
|
|
|
|
|
|
|
|
Manufacturing
Capabilities
| |
China |
Japan |
| Items |
|
Standard |
Advanced |
Standard |
Advanced |
Max.
Board Size(mm) |
PCB
Size |
570
X 470 |
620X813 |
460
X 530 |
Depends on spec |
Maximum
No. of Layers |
|
2-30 |
50 |
1
to 40 |
|
Board
Thickness(mm) |
Single
Layer |
0.2-6.0 |
0.3-8.0 |
0.10
- 3.2 |
0.06 |
| Double
Layer |
0.6 |
0.2 |
0.10-3.2 |
0.06 |
| 4
Layer |
0.80
- 1.60 |
0.40
- 3.00 |
0.50-3.20 |
0.40-0.50 |
| 6
Layer |
1.20-1.60 |
0.60-3.00 |
0.80-3.20 |
0.60-0.70 |
| 8
Layer |
1.40
- 1.80 |
1.00
- 3.00 |
1.00-3.20 |
0.80-0.90 |
| 10
Layer |
1.60
- 2.00 |
1.20
- 3.00 |
1.20-3.20 |
1.00-1.10 |
| 12
Layers |
1.80
- 2.20 |
1.40
- 3.00 |
1.40-3.20 |
1.20-1.30 |
Trace(mm) |
Width |
0.10 (4mil) |
0.075 (3mil) |
0.07(2.76mil) |
0.05-0.07 |
| Clearence |
0.10 (4mil) |
0.075 (3mil) |
0.07(2.76mil) |
Depends on spec |
Hole
Size(mm) |
Min.
PTH |
0.2 mm |
0.15 mm |
0.2 |
0.15 |
Laser
Drill(mm) |
|
|
0.1 mm |
0.15 |
|
High
Oz Copper |
|
up
to 6 oz |
up to 8 oz |
up
to 4 oz |
|
Impedance
Controlled Bd |
|
10% |
+ / - 5% |
10% |
10% |
Build
Up Capabilities |
|
Yes |
Yes |
Yes |
|
Aspect
Ratio |
|
13:1 |
15:1 |
10 or under |
12 |
IVH,
Blind/Buried Vias |
|
Yes |
Yes |
Yes |
|
Our
Facilities includes.....
|
